? semiconductor components industries, llc, 2012 july, 2012 ? rev. 6 1 publication order number: mrs1504t3/d mrs1504t3g, NRVS1504T3G surface mount standard recovery power rectifier smb power surface mount package features mesa epitaxial construction with glass passivation. ideally suited for high frequency switching power supplies; free wheeling diodes and polarity protection diodes. features ? compact package with j ? bend leads ideal for automated handling ? stable, high temperature, glass passivated junction ? aec ? q101 qualified and ppap capable ? nrvs prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb-free* mechanical characteristics: ? case: molded epoxy ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 95 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? maximum temperature of 260 c / 10 seconds for soldering ? polarity: notch and/or band in plastic body indicates cathode lead ? esd ratings: ? machine model = c ? human body model = 3a *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information standard recovery rectifier 1.5 amperes, 400 volts smb case 403a plastic marking diagram http://onsemi.com a = assembly location y = year ww = work week rgg = device code = pb ? free package (note: microdot may be in either location) ayww rgg mrs1504t3g smb (pb ? free) 2,500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. NRVS1504T3G smb (pb ? free) 2,500 / tape & reel
mrs1504t3g, NRVS1504T3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 400 v average rectified forward current (at rated v r , t i = 118 c) i o 1.5 a peak repetitive forward current (rated v r , square wave, 20 khz, t i = 118 c) i frm 3.0 a non ? repetitive peak surge current (surge applied at rated load conditions, halfwave, single phase, 60 hz) i fsm 50 a storage/operating case temperature range t stg , t c ? 55 to 150 c operating temperature range t j ? 55 to 150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics rating symbol value unit thermal resistance, junction ? to ? lead (note 1) r tjl 18 c/w thermal resistance, junction ? to ? ambient (on 1 sq. cu. pcb pattern) r tja 79 c/w 1. minimum pad size. electrical characteristics rating symbol t j = 25 c t j = 100 c unit maximum instantaneous forward voltage (note 2), see figure 2 (i f = 1.5 a) (i f = 2.25 a) v f 1.04 1.10 0.96 1.02 v maximum instantaneous reverse current, see figure 4 (v r = 400 v) (v r = 200 v) i r 1.0 0.5 340 180 a 2. pulse test: pulse width 250 s, duty cycle 2.0%
mrs1504t3g, NRVS1504T3G http://onsemi.com 3 figure 1. typical forward voltage figure 2. maximum forward voltage figure 3. typical reverse current figure 4. maximum reverse current 0.6 v f , instantaneous forward voltage (volts) 100 10 1.0 v f , maximum instantaneous forward voltage (volts) 0.6 1.0 0.1 400 0 v r , reverse voltage (volts) 100e-6 10e-6 1.0e-6 100e-9 10e-9 1.0e-9 v r , reverse voltage (volts) i f , instantaneous forward current (amps) i 0.1 1.2 0.8 1.0 1.6 0.8 1.0 1.2 1.6 10 100 100 200 300 i f , instantaneous forward current (amps) , reverse current (amps) r 400 0 10e-9 1.0e-3 100e-6 10e-6 1.0e-6 100e-9 i 100 200 300 , maximum reverse current (amps) r t j = 150 c t j = 100 c t j = -40 c t j = 25 c t j = 150 c t j = 100 c t j = 25 c t j = 150 c t j = 100 c t j = 25 c 100 1.4 1.4 10e-3 t j = 150 c t j = 100 c t j = 25 c square wave figure 5. current derating figure 6. forward power dissipation 20 60 0 t l , lead temperature ( c) 2.5 2.0 1.5 1.0 0.5 0 i o , average forward current (amps) 0.5 0 2.5 2.0 1.5 0.5 0 2.0 40 , average forward current (amps) i o 80 120 100 1.0 1.5 2.5 1.0 p fo , average power dissipation (watts) 160 dc i pk /i o = i pk /i o = 5 i pk /i o = 10 i pk /i o = 20 i pk /i o = 20 i pk /i o = 10 i pk /i o = 5 i pk /i o = square wave dc 140 freq = 20 khz
mrs1504t3g, NRVS1504T3G http://onsemi.com 4 figure 7. capacitance 60 0 v r , reverse voltage (volts) 100 10 1.0 c, capacitance (pf) 30 10 20 40 50 70 80 t j = 25 c figure 8. thermal response, junction ? to ? lead figure 9. thermal response, junction ? to ? ambient 100 0.1 0.00001 t, time (s) 1.0 0.1 0.01 r 0.0001 0.001 0.01 1.0 10 0.001 , transient thermal resistance (normalize d (t) t, time (s) 1.0 0.1 0.01 r 0.001 , transient thermal resistance (normalized) (t) rtjl(t) = rtjl*r(t) 50% 20% 10% 5.0% 2.0% 1.0% 100 0.1 0.00001 1,000 0.0001 0.001 0.01 1.0 10 rtjl(t) = rtjl*r(t) 50% 20% 10% 5.0% 2.0% 1.0%
mrs1504t3g, NRVS1504T3G http://onsemi.com 5 package dimensions smb case 403a ? 03 issue j 2.261 0.089 2.743 0.108 2.159 0.085 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension b shall be measured within dimension l1. dim a min nom max min millimeters 1.95 2.30 2.47 0.077 inches a1 0.05 0.10 0.20 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.091 0.097 0.004 0.008 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are registered trademar ks of semiconductor components industries, llc (s cillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to an y products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of th e application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products ar e not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associ ated with such unintended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action em ployer. this literature is subject to all applicable copyrig ht laws and is not fo r resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mrs1504t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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